Poliimid
9. Irodalomjegyzék
[28] David J.J.; Study of the x-ray production mechanism of a dense plasma focus, Journal of Applied Physics Volume 45, Issue 3, Mar 1974 Page(s):1147 - 1153 DOI: 10.1063/1.1663381
[29] Kawamura Y.,Toyoda K., Namba S.: Effective Deep Ultraviolet Photoetching of
Polymethylmethacrylate by an Eximer Laser, Applied Physics Letters vol. 40, 1982, pp. 373
[30] Pham D., Tonge L., Cao J.,Wright J.,Papiernik M.,Harvey E. Nicolau D.: Effects of polymer properties on laser ablation behaviour, Smart Mater. Struct. 11, pp. 668-674, 2002
[31] Collins G.B.: Laser Processing of Polyimide on Copper, 2001, Citeseer [32] Calderón J.B.: Oberflächenmodifizierung und-analytik von Polyimid, 2005
[33] Matthew A.R., Rossier J.S., Bercier P., Girault H.: UV Laser Machined Polymer Substrates for the Development of Microdiagnostic Systems, Anal. Chem., 1997, 69 (11), pp 2035–2042
[34] Masubuchi T., Tada T.,Nomura E., Hatanaka K.,Fukumura H., Masuhara H.: Laser-Induced Decomposition and Ablation Dynamics Studied by Nanosecond Interferometry. J. Phys. Chem. pp.
2180-2186, 2002
[35] Lippert T., Dickinson J.T.: Chem. Rev. 103, 453 (2003).
[36] Coupland K.,Herman P.R., Gu B.: Laser cleaning of ablation debris from CO2-laser-etched vias in polyimide, Applied Surface Science Volumes 127-129, May 1998, Pages 731-737
[37] Lippert T.,Hauer M.R., Phipps C.R., Wokaun A.: Fundamentals and applications of polymers designed for laser ablation, Appl. Phys. A: Mater. Sci. Process. 77, 2, 2003
[38] Oliveira V.,Vilar R.: Finite element simulation of pulsed laser ablation of titanium carbide Applied Surface Science Volume 253, Issue 19, 31 July 2007, Pages 7810-7814
[39] Bityurin N.: UV etchning accompanied by modifications. Appl. Phys. Lett. 138-139, 354 (1999).
[40] Schmidt H.,Ihlemann J.,Wolff-Rottke B., Luther K., Troe J.: Ultraviolet laser ablation of polymers: spot size, pulse duration, and plume attenuation effects explained, J. Appl. Phys. 83, 5458 (1998).
[41] Arnold N.,Luk'yanchuk B.,Bityurin N.: A Fast Quantitative Modeling of Ns Laser Ablation Based on Non-stationary Averagig TechniqueAppl. Surf. Sci. 129, 184 (1998).
[42] Andrew J. E., Dyer P. E., Forster D., Key P. H.: Direct etching of polymeric materials using a XeCl laserAppl. Phys. Lett. 43, 717 (1983).
[43] Srinivasan R., Braren B.: Ablation of Polymers and Biological Tissue by Ultraviolet Lasers, Chem. Rev.
(Washington, DC, U. S.) 89, 1303 (1989).
[44] Lazare S., Granier V.: Ultraviolet Laser Photoablation of Polymers, Laser Chem. 10, 25 (1989).
[45] Küper S., Brannon J., Brannon K.: Threshold Behavior in Polyimide Photoablation: Single-Shot Rate Measurements and Surface Temperature ModelingAppl. Phys. A 56, 43 (1993).
[46] D'Couto G. C., Babu S. V.: Heat transfer and material removal in pulsed excimer-laser-induced ablation:
Pulse-width dependenceJ. Appl. Phys. 76, 3052 (1994)
[47] Jellinek H. H. G., Srinivasan R.: Theory of Etching of Polymers by Far-Ultraviolet, High-Intensity Pulsed Laser and Long-term Irradiation, Journal of Physical Chemistry vol. 88, 1984, pp. 3048-3051 [48] Hauer M.R., Funk D.J., Lippert T.A.:Laser ablation of a triazene polymer studied by ns-interferometry
and shadowgraphy Wokaun High-Power Laser Ablation IV, Claude R. Phipps, Editor, Proceedings of SPIE Vol. 4760 (2002)
[49] Hayes J.: Excimer and 3ω Nd:YAG machining of polymers and cermaics, Electronics Systemintegration Technology Conference. Dresden, Germany,2006
[50] Bauerle D.: LaserProcessing and Chemistry, Springer Verlag (2000), ISBN 3-540-66891-8.
[51] Tamura. H., Miyao M., Tokuyama T.: 1979, Laser-Annealing Behaviour of a Phosphorus-Implanted Silicon Substrate Covered with SiO2 Film, J. Appl. Phys., 50, pp. 3783-3784.
[52] Grigoropoulos C.P., Park H. K., Xu, X., 1993, Modeling of Pulsed Laser Irradiation of Thin Silicon Layers, Int. J. Heat Mass Transf., 36, pp. 919-924.
[53] Mansuripur M., Connell G.A.N., Goodman J.W.: 1982, Laser-Induced Local Heating of Multilayers, Int.
J. Heat Transfer, 115, pp. 178-183
[54] Nakano S. et al.:1986, Laser Patterning Method for Integrated Type a-Si Solar Cell Submodels, Jpn. J.
Appl. Opt., 21, pp. 1936- 1945.
[55] McGahan W. A., Cole K.D.: 1992, Solution of Heat Conduction Equation in Multilayers for Photothermal Deflection Experiments, J. Appl. Phys., 72, pp. 1362- 1373.
[56] Chylak B, Qin I.W.: Packaging Challenges and Solutions for Multi-Stack Die Application, IEEE, International Electronics Manufacturing Technology Symposium, Prague, 2002. pp
[57] Tee Y.T., Zhong Z.: Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages, Microelectronics Reliability, 2004, vol. 44. pp 1957-1965.
[58] Rickert P. Krenik W.: Cell phone integration: SiP, SoC, and PoP , Design & Test of Computers, IEEE, Vol: 23/3,2006, pp.188-195
[59] Kim J, Lee K, Park D. at all: Application of Through Mold Via (TMV) as PoP Base Package, IEEE, Electronic Components and Technology Conference 2008, Florida, pp.1089-1092
[60] Yoshida A, Ishibashi K.: Design and Stacking of An Extremely Thin Chip-Scale Package, 2003, IEEE, Electronic Components and Technology Conference, NewOrleans, pp.1095-1100
[61] Ren C., Qin F.: Parametric study of warpage in Package-on-Package manufacturing , Electronic Packaging Technology & High Density Packaging, 2009. pp. 339-343.
[62] Xavier B.: System in Package, an overview of ST solutions for 3D packaging, IMAPS 2004.
[63] Hara Y.: 3-D chip vendor corrects course, EE Times, 2005.
[64] Hara Y.:ZyCube prep packaging technology for image sensors , EE Times, 2007.
[65] Vardaman J.: What's Delaying the Adoption of 3-D TSV? Semiconductor International, 3/1/2008 [66] Garrou P.: 3D ICs Enter Commercialization, Semiconductor International , 11, 2008
[67] Fjelstad J.: 3rd Flexible Circuit Technology, 2006, BR Publishing, Inc
[68] Skaggs C.W.,Sperling R.A.: Structural Design Anaysis Applied to Flexible Circuits, IEEE Transactions on Manufacturing technology dec. 1976 78-83
[69] Rézfólia mechanikai jelemzıi, Interentes adatbázis, MatWeb. http://www.matweb.com/.
[70] Prohászka J.: Bevezetés az anyagtudományba, Nemzeti tankönyvkiadó, Budapest, 1988.
[71] Pattantyús Gépész- és Villamosmérnökök kézikönyve. 2. kötet. Mőszaki Könyvkiadó, Budapest, 1961 [72] Flexural Fatigue and Ductility, Flexible Printed Wiring Materials, IPC-TM- 650 szabvány, No. 2.4.3.1.
[73] Tensile Strength and Elongation, FLexible Printed Wiring Materials, IPC-TM- 650 szabvány, No. 2.4.19 [74] Pepper W.D., Heinrich J.C., : The Finite Element Method. Taylor & Francis, New York, 2006.
[75] Chung T.J. : General Continuum Mechanics, Cambridge University Press, 2007.
[76] Witmer E.A.,: Elementary Bernoulli-Euler Beam Theory. MIT Unified Engineering Course Notes: pp. 5- 114, 1992.
[77] Shigley J.: Mechanical Engineering Design, McGraw Hill, 1986, ISBN 0-07-100292-8 [78] Nádori F., Szibrik S.: Szilárdságtan, Mechanika Tanszék, 2008, Miskolc.
[79] Steen W.M.: Laser Material Processing, Springer Verlag, 1998.
[80] Schaeffer R.: Frequency Quadrupled (266 nm Wavelength) Lasers, ‘Seeing the Light’, CircuiTree, Business News Publishing Company, Northbrook, IL, August, 2002.
[81] Coherent, Inc.: Operations manual, 2001
[82] Raylase AG, 2001, Physik Instrumente GmbH, 1999
[83] Dyer P. E., Sindhu J.: Excimer laser ablation and thermal coupling efficiency to polymer films, Journal of Applied Physics vol. 57, 1985, pp. 1420-1430
[84] Brunco D. P., Thompson M. O., Otis C. E., Goodwin P. M.: Temperature Measurements of Polyimide During KrF Excimer Laser Ablation, Journal of Applied Physics vol. 72, 1992, pp. 4344-4350 [85] Küper S.,Brannon J.,Brannon K.: Threshold Behavior in Polyimide Photoablation: Single-Shot Rate
Measurements and Surface Temperature Modeling, Applied Physics A. vol. 56, 1993, pp. 43-50 [86] Yung W. K. C., Liu J. S., Man H. C., Yue T. M.: 355 nm Nd:YAG Laser Ablation of Polyimide and its
Thermal Effect, Journal of Materials Processing Technology vol. 101, 2000, pp. 306-311 [87] A réz és Kapton® poliimid folia mechanikai jellemzıi. Internetes adatbázi, MatWeb.
http://www.matweb.com/
[88] Pepper W.D., Heinrich J.C., : The Finite Element Method. Taylor & Francis, New York, 2006.
[89] Zimmerman W.B. : Multiphysics Modelling with Finite Element Methods, Word Scientific, Singapore, 2008.
6.8. ábra Poliimid alapú hajlékony áramköri hordozó dinamikus igénybevétele ...68 6.9. ábra Poliimid alapú hajlékony áramköri hordozó dinamikus igénybevétele közben jelentkezı szakadások
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