Interconnection between microstructure and microhardness of directionally solidifi ed binary Al-6wt.Cu and multicomponent Al-6wt.Cu-8wt.Si alloys

E para isso precisaram saber aprender a demandar do Estado brasileiro uma intervenção sob a ideologia da ordem e da segurança nacional, como essa que presenciamos nos

• Dual “Participating Areas” are created to help owners reach agreement on equity shares. •

O objetivo do presente trabalho foi avaliar a perda da hermeticidade do sistema de embalagens plásticas flexíveis utilizadas para o envase de carne bovina cozida e desidratada

corner of Al-Cu-Si phase diagram, dashed lines show the univariant binary eutectic Al-Si and Al-Cu reactions. Figure 2 shows Al-rich corner of Al-Ag-Cu phase diagram, dashed

Effect of the temperature gradient, growth rate, and the interflake spacing on the microhardness in the directionally solidified Al-Si

The experimental results include solidification thermal parameters such as tip growth rate and cooling rate, optical microscopy, volume fraction of the eutectic mixture,

Measurements of microhardness during transient horizontal directional solidification of Al-rich Al-Cu alloys: Effect of thermal parameters, primary dendrite arm spacing and

The probability of attending school four our group of interest in this region increased by 6.5 percentage points after the expansion of the Bolsa Família program in 2007 and