International, peer-reviewed journal papers, written in the English language
[L7] Skwarek, A., Krammer, O., Hurtony, T., Ptak, P., Górecki, K., Wroński, S., Straubinger D., Witek, K., ,Illés, B. (2021). Application of ZnO nanoparticles in
Sn99Ag0.3Cu0.7-based composite solder alloys. In Nanomaterials, 11(6), 1545., doi: 10.3390/nano11061545
[L8] Straubinger, D., Bozsóki, I., Illes, B., Krammer, O., Bušek, D. and Geczy, A.
(2020), "Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces", Soldering & Surface Mount Technology, Vol. 32 No. 4, pp. 247-252., doi: 10.1108/SSMT-11-2019-0038.
International, peer-reviewed conference papers, written in the English language
[R8] Alaya, M. A., Gál, L., Hurtony, T., Medgyes, B., Straubinger, D., Tareq, A. M.,
& Géczy, A. (2019). Wetting of different lead free solder alloys during vapour phase soldering. In 2019 42nd International Spring Seminar on Electronics
Technology (ISSE) (pp. 1-6). IEEE.,
doi: 10.1109/ISSE.2019.8810204.
[R9] Géczy, A., Szalmási, D., Straubinger, D., & Illés, B. (2019). Investigating shadowing and possible tombstoning caused by large SMD components during vapour phase reflow soldering. In 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) (pp. 343-346). IEEE., doi: 10.1109/SIITME47687.2019.8990744.
[R10] Illés, B., Skwarek, A., Krammer, O., Straubinger, D., Lakó, B., Harsányi, G., &
Witek, K. (2021). Soldering with SACX0307-(TiO 2/ZnO) nano-composite solder alloys. In 2021 44th International Spring Seminar on Electronics Technology (ISSE) (pp. 1-6). IEEE., doi: 10.1109/ISSE51996.2021.9467652
[R11] Illés, B., Skwarek, A., Krammer, O., Hurtony, T., Straubinger, D., Ratajczak, J.,
& Witek, K. (2021). Properties of nano-composite SACX0307-(ZnO, TiO 2) solders. In 2021 23rd European Microelectronics and Packaging Conference &
Exhibition (EMPC) (pp. 1-6). IEEE., doi: 10.23919/EMPC53418.2021.9585015 [R12] Géczy, A., Alaya, M. A., Rozs, E., Straubinger, D., & Illés, B. (2021). Flow and
Gauge Sensor Fusion in Vapour Phase Soldering Ovens for Optimized Process Control. In 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (pp. 111-114). IEEE., doi: 10.1109/EPTC53413.2021.9663870
[R13] Géczy, A., Csiszár, A., Rozs, E., Hajdu, I., Medgyes, B., Krammer, O., Straubinger, D., Gál, L. (2022, May). Novel PLA/Flax Based Biodegradable Printed Circuit Boards. In 2022 45th International Spring Seminar on Electronics Technology (ISSE) (pp. 1-6). IEEE., doi: 10.1109/ISSE54558.2022.9812827
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